OTA: TIP Summit, Aircraft Reflections, 3D Printed Communications, and More

University of Washington's 3D printed transmitters

The team from Lime Microsystems will be at the Telecom Infra Project (TIP) Summit in London next week, with a range of LimeNET and CrowdCell demonstrations. Part of the cross-vendor Telecom Infra Project (TIP), founded to encourage openness and disaggregation in access, backhaul, and core & management of a modern telecommunications infrastructure, the TIP Summit…

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